MONITORING THE TECHNICAL STATE OF RESISTIVE POTENTIOMETERS USING SCANNING
ELECTRON MICROSCOPY 

Ishkov Anton Sergeevich, candidate of technical sciences, associate professor, sub-department of radioengineerin and radioelectronic systems, Penza State University (40 Krasnaya street, Penza, Russia); senior researcher, Scientific Research Institute of electro-mechanical devices (44 Karakozov street, Penza, Russia), ishkovanton@mail.ru
Svetlov Anatoliy Vil'evich, doctor of technical sciences, professor, head of sub-department of radioengineering and radioelectronic systems, Penza State University (40 Krasnaya street, Penza, Russia), rtech@pnzgu.ru
Solodimova Galina Anatol'evna, candidate of technical sciences, associate professor, syb-department of information-measuring technique and metrology, Penza State University (40 Krasnaya street, Penza, Russia), solodimova@mail.ru
Torgashin Sergey Ivanovich, candidate of technical sciences, head of syb-department of rocket-space and aerospace instrumentation, Penza State University (40 Krasnaya street, Penza, Russia), rkap@pnzgu.ru

620.171.20

10.21685/2307-5538-2017-4-11

Background. The object of research is resistive wire potentiometers, the structure and composition of products are considered, the main nodes are determined, ensuring the compliance of performance characteristics with the stablished requirements. The subject of the study are methods of detecting defects formed in the resistive element and the details of the wire potentiometers during their manufacture. The aim of the work is the development of methods for manufacturing highly reliable potentiometers using the means of technical control based on scanning electron microscopy.
Materials and methods. To conduct research on the detection of internal hidden defects of wire potentiometers, an x-ray spectral microanalysis method was used to monitor defects in micro- and nanoscale objects and perform an analysis of the chemical composition of materials.
Results. The types and mechanism of influence of wire potentiometer defects, leading to their failures, are considered. It is established that the violation of the winding step of the resistive element, microcracks and foreign inclusions are the main types of defects. The recommendations for improving the technological process for manufacturing wire potentiometers have been developed, which make it possible to reduce the percentage of rejects in their production. Technical solutions allowing to improve the quality of the resistive element are given.
Conclusions. Monitoring the technical condition of wire potentiometers with the use of scanning electron microscopy can improve the quality and reliability of products by improving the manufacturing technology and detecting defects that are not detected visually.

wire potentiometers, failure, resistive element, electronic raster microscope